QUESTIONS:
** SHOW ALL WORK AND JUSTIFY METHOD BY SHOWING EQUATION DERIVATION **
** SHOW ENERGY BALANCE AND INCLUDE RADIATION AND CONVECTION EFFECTS **
A SILICONE PAD IS MOLDED TO AN ALUMINUM DIE THAT IS CONNECTED TO A BASE. THAT BASE IS FASTENED TO AN ALUMINUM BLOCK WITH A HEATING ELEMENT IN THE CENTER THAT CAN PRODUCE QGEN MAXIMUM OF 700 W. THE ALUMINUM HEATING ELEMENT BLOCK IS CONNECTED TO A STAINLESS STEEL SUPPORT STRUCTURE THAT ACTS AS A HEAT SINK.
1. WHAT IS THE OPTIMAL THERMAL CONDUCTIVITY OF SILICONE PAD?
2. HOW LONG DOES IT TAKE THE ALUMINUM SYSTEM TO GET TO STEAD-STATE?
3. HOW LONG DOES IT TAKE FOR THE SILICONE PAD TO REACH STEADY-STATE? SHOW ENERGY BALANCE AND INCLUDE RADIATION AND CONVECTION EFFECTS.
4. THE PAD NEEDS MAKES CONTACT WITH A POLYESTER SUBSTRATE (HEAT SINK ) OF SAME AREA AND MUST REMAIN IN CONTACT FOR 30 SECONDS. ASSUMING HEAT TRANSFER TO POLYESTER IS PURE CONDUCTION, WILL THE HEAT TRANSFER BE SUFFICIENT TO EXPOSE THE SUBSTRATE TO A CONSTANT 118 C IN ORDER TO CURE? IF NOT, WHAT NEEDS TO BE CHANGED AND HOW?
ASSUMPTIONS:
START TEMPERATURES = 25 C
CONVECTION & RADIATION EFFECTS NEED TO BE INCLUDED
– (USE SIDE AREA FOR ALUMINUM ALL )
– (USE ALL AREA FOR SILICONE)
MAX TEMPERATURE TD = 200 C
MAX TEMPERATURE Ts = 118 C
AIR TEMPERATURE T0 = 25 C
Q gen = 700 W
ADDITIONAL AREA AND LENGTH VALUES FOR EACH COMPONENT SHOWN IN POWER POINT